Fibocom, a global leading provider of AIoT solutions and wireless communication modules, announces its brand-new Fibocom AI Stack, an integrated set of hardware, AI tools, AI engines, resourceful AI models, offering a fast-to-deploy solution for industry customers to intelligentize their devices with on-device AI.
Laying the focus on device-side AI adoption, Fibocom AI Stack is designed to address the challenges of diverse demands for intelligent transformation across different industries by providing a complete solution to facilitate the deployment of AI models on smart devices.
Key Capabilities
Cross-Platform and Cross-System Flexibility: Leveraging the compatibility with mainstream AI frameworks like TensorFlow, PyTorch, ONNX and MXNet, etc. and the support of multi-tier computing chips and modules, Fibocom AI Stack provides the optimal strategy for device-side AI deployment through the integration of an easy-to-deploy code and accessible AI toolchain for data annotation, model training, fine-tuning, achieving high-accuracy and high-speed inference.
Powerful On-device AI Engine: Fibocom AI Stack’s high-performance inference engine ensures efficient operation, enhancing performance while minimizing power consumption. This aspect is crucial for real-world applications where resources are constrained. Additionally, it supports multi-language SDK interfaces, third-party apps as well as hardware accelerator.
Simplifying On-device AI Development: Fibocom AI Stack provides an extensive library of AI models (e.g., for audio, CV, LLMs, multimodal LLMs) and provides the value-added model selection and fine-tuning service to help customers to develop industry-oriented models. Therefore, companies of any size can benefit from the manageable service, accelerating on-device AI deployment globally.
The versatility and compatibility of Fibocom AI Stack significantly ease the complexity of on-device AI deployments where many terminal devices are constrained with limited computational power and energy efficiency, making it a master tool for the intelligent transformation in smart retail, autonomous vehicles, smart wearables, robotics. It is worth mentioning that Fibocom AI Stack works across multiple Fibocom AI module and smart module series, supporting the computation power from entry to premium level.
“In the wave of AI-first, we are proudly seeing Fibocom leverages AI innovations and in-depth industry expertise to empower the on-device AI deployment with our game-changer Fibocom AI Stack, enabling businesses to scale smart devices in various industries with high-efficiency, cost-effective approaches,” said Willson Liu, President of Fibocom AI Research Institute.
“Looking forward, we are expecting to collaborate with more industry customers to build their smart devices with Fibocom-empowered on-device AI solutions and enable a smart future with AI productivity.”
Explore more about Fibocom AI Stack, welcome to book a meeting with our sales team or visit us at IMC’s booth #10577 in the North hall at CES 2025 from January 7-10.
